New! Download: Press Pad Technical Paper April 28th , 2008 New! Download our Arlon UltraPad™ Brochure New! Download our Thermabond® Guide New! Download: Developing Silicone Rubber Flame Resistance April 11th , 2008 Arlon to exhibit at the IPC Printed Circuits Expo®, APEX® and the Designers Summit Arlon to exhibit at the 17th International Electronic Circuits Exhibition, CPCA Show 2008 Arlon to exhibit at CWIEME Berlin Arlon 427CR - Best in Class Thermal Stability October 18, 2007 Arlon has introduced a next generation flexible heater compound, 427CR. This UL-recognized compound delivers best in class thermal stability performance. Download our application note to see detailed test results. Silicone Rubber Flame Resistance June 12, 2007 Arlon Chemist presents a technical overview of flame resistant technologies used by Arlon, including focus on FAR 25.856. Research Progress in Calenderable Fluorosilicone with Excellent Fuel Resistance June 3, 2007 Arlon Chemist describes a new fluorosilicone compound for applications with critical fuel resistant requirements. The Permeability Characteristics of Silicone Rubber November 7, 2006 Arlon Chemist presents a technical review of the gas permeability characteristics of silicone rubber, with special focus on a technology to reduce gas permeability. Void Reduction During Low Pressure Lamination of Electronic Assemblies October 12, 2006 Arlon Chemist shows how an innovative lamination technique can significantly reduce void formation during low pressure electronic assembly bonding. New Advances in Primerless Silicone Insulation Materials September 19, 2006 Arlon Product Development Manager shows how primerless silicone technology outperforms contentional insulation while signficiantly simplifying the insulation application process. Arlon STD to make technical presentation at IMAPS 2006 April 20, 2006 Arlon Electronic Materials, consisting of both the Silicone Technologies Division and the Materials for Electronics Division, will make presentations at IMAPS 2006 in San Diego. Preview the Arlon STD presentation abstract Void Reduction During Low Pressure Lamination of Populated Electronic Assemblies . Thermal-Mechanical Decoupling by a Thermal Interface Material December 12, 2005 Arlon STD R&D Chemist explains the leading edge technology in today's electronics adhesives. Arlon STD exhibits and presents technical paper at EIC/EM Expo November 15 , 2005 |